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Home » products » Bonding grades

Evonik - We boost the next generation of biomaterials for your medical devices to improve the quality of life.

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Bonding grades

VESTAMID® Care ME-B grades cover a range of polyether-block-amides (PEBA) with different flexibility and hardness, which were specially modified to adhere to Daikin’s Neoflon® EFEP RP-5000 without the need for any adhesive. The chemical nature of both materials results in the formation of covalent bonds among the polymer chains of VESTAMID Care ME-B and Neoflon® EFEP at the boundary layer upon processing via coextrusion. Thereby, multilayer tubings can be realised, whichcombine the individual properties of both EFEP and PEBA, and do not contain any compatibiliser or adhesive, that might migrate out of the device.

Contact Evonik - We boost the next generation of biomaterials for your medical devices to improve the quality of life.

Evonik - We boost the next generation of biomaterials for your medical devices to improve the quality of life.