The wire bonded fuse offers extremely low impedance values compared to competitive products, providing exceptional performance in dense circuits.
Unlike competing fuses, the USFF 1206 200mA version offers a voltage drop value at rated current of 87mV, which is about three times less than competive products. The wire bonding makes the fuse stable and reliable with an operating temperature range of -55°C to 90°C. It is especially designed for protecting DC over-current conditions where heat dissipation is critical, including computer peripherals and communication equipment. The product includes cURus agency approval and is RoHS compliant and halogen-free.