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Home » casestudies » Die Bonding Machine

Case Study

Die Bonding Machine

Our client required an automated die bonding machine that could pick Micro-Electro-
Mechanical (MEMs) die from a glass handle wafer and place a specified number of them onto a prepared, non-rigid laminated substrate to within 4 micron accuracy in three axes. The machine was for use in a cleanroom environment and a fast cycle-time was critical.